On this episode of Embedded Insiders, Paul Beckmann, CTO of DSP Concepts, takes us behind the scenes of TWS to reveal what we can expect from the rapidly-evolving audio technology in the years to come. And, what engineers can do to prepare for the next generation of wireless audio product development.

Applications that require high-quality audio are fraught with issues.

With a pool of new talent throughout the globe, the embedded audio leader continues its expansion into new and existing verticals.

DSP Concepts announced the fully optimized Audio Weaver library available for the Cadence Tensilica HiFi 5 DSP with general release by the end of Q2 2021.